Wet Chemical Stations / Benches

Nano Clean Wet Chemistry cleaning benches provides economical solution for acid etching, wafer rinsing, N2 drying and cleaning of silicone wafers.

Typical construction materials include polypropylene, stainless steel, PVDF as well as Teflon®, PFA, and ECTFE (HALAR®) depending on the chemical handling properties required for the application.

Nano Clean offer cleaning solutions for front end back end cleaning.

Front end
It is used for pre-diffusion, pre-furnace & RCA. Some of the common front end cleaning are

1. Resist Strip
2. Nitride etch or strip
3. Residue clean, post etch, or post ash clean
4. Oxide etch
5. STI (shallow trench isolation) clean Rinsing tanks

After cleaning/etching the wafers are rinsed in water to remove the residue acid on the wafer. ‘

Some of common rinse tanks are
1. Quick dump tank with top and side spray
2. Cascade type
3. Overflow Ultrasonic tank

Back end
Solvent Wet Benches are common in back end wet processing since wafers have metal on them. Acid chemistries used in front end process can damage the structure, so solvents are popular BEOL cleaning chemicals.

Some of the common back end cleaning are
1. Resist and residue removal (post ash clean)
2. Post Etch polymer Cleans
3. Post CMP Cleaning